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PLCC 68 SMD
* mit dem gleichen Anschluss-Layout wie der Chip
* hochtemperaturfest
* Isolierkörper: Thermoplast,UL94V-0, schwarz
* Kontaktmaterial (DIN17660): CuSn (Phosphor Bronze)
* Kontaktoberfläche: verzinnt, bleifrei
* Durchgangswiderstand, max.: 40mΩ
* Nennstrom: 1A
* Isolationsspannung: 250V DC
* Isolationswiderstand, min.: >500MΩ
* Temperaturbereich: -40...+85°C
* kurzzeitig (10s): +260°C
* Lötbarkeit: IEC 68-2-20 Tb
SMD-PLCC-Fassungen
* für SMD-Montage (gem. JEDEC MΩ-047 / MΩ-025)* mit dem gleichen Anschluss-Layout wie der Chip
* hochtemperaturfest
* Isolierkörper: Thermoplast,UL94V-0, schwarz
* Kontaktmaterial (DIN17660): CuSn (Phosphor Bronze)
* Kontaktoberfläche: verzinnt, bleifrei
* Durchgangswiderstand, max.: 40mΩ
* Nennstrom: 1A
* Isolationsspannung: 250V DC
* Isolationswiderstand, min.: >500MΩ
* Temperaturbereich: -40...+85°C
* kurzzeitig (10s): +260°C
* Lötbarkeit: IEC 68-2-20 Tb
PLCC 68 SMD
Technische Daten
| Hersteller | MPE Garry |
| Herstellerbezeichnung | 082-1-068-0-XT0 |
| E [mm] | 38,3mm |
| Polzahl | 68 |
| A [mm] | 30,82 |
| Breite [mm] | 30,82 |
| e [mm] | 38,3 |
| d [mm] | 20,32 |
| c [mm] | 20,32 |