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FEP 300x210 mm
Bungard and Rademacher epoxy board series BEP_1 and FEPCU
Fibreglass-reinforced epoxy boards with a 35µm Cu layer and photoresist on one side. They are suitable for manufacturing PCBs, absolute even and dust-free distribution of the photoresist, as well as with exact fixed measurements. We offer various types of these series.
FEP 300x210 mm
Specifications
| manufacturer | Bungard |
| Manufacturer's name | 120306E36 |
| Dimensions [mm] | 300x210 |