No products
* melting point: 217°C
* flux type (IEC 61190-1-3 REL0): 1.2.3.B
* flux content (EN 12224): 3%
* corrosive effects (DIN 8516): none
* alloy (FLOWTIN TSC): Sn95Ag4Cu1/713
* flux core: 1 core
* diameter: 1mm
* by Stannol
* halide-free activated
* developed to cope with the higher process temperatures at lead-free soldering
* very low spitting of flux
* with micro doted alloys for the low solder tip consumption
* high activity, good spread and high residue reliability
* flux residues - can be left on the PCB
* hand and robot soldering
* electronic and electrical industry