lead-free soldering wires KS 115 TSC by Stannol

• melting point: 217°C
• flux type (IEC 61190-1-3 REM1): 1.2.2.B
• flux content (EN 12224): 3%
• corrosive effects (DIN 8516): none
• alloy (FLOWTIN TSC): Sn95Ag4Cu1/713
• flux core: 1 core
• diameter: 0.7mm
• by Stannol

• halide activated
• developed to cope with the higher process temperatures at lead-free soldering
• very low spitting of flux
• with micro doted alloys for the low solder tip consumption
• high activity, good spread and high residue reliability
• flux residues - can be left on the PCB
• hand and robot soldering
• electronic and electrical industry